PCB Blistering in PCB Manufacturing: Plating-Related Causes PCB blistering is a plating-related surface defect in printed circuit board (PCBs) fabrication, characterized by localized separation o...

SMT vs DIP in PCB Assembly Manufacturing: Process, Differences and Applications In modern printed circuit board assembly (PCBA), both Surface Mount Technology (SMT) and DIP insertion ...

PCB 在生产与组装过程中出现分层和起泡的原因分析 在高可靠性电子制造中，PCB 分层并不只是外观问题，而是一种结构性失效模式。它可能发生在多层板制造或PCBA 组装过程中，并进一步影响信号完整性、热稳定性以及产品的长期可靠性。 什么是 PCB 的分层与起泡 按照 IPC-A-610 标准： 起泡（Blistering）：指层压基材内部，或基材与...

2026 PCB Trends in AI Servers PCB satisfies the revolution in AI compute-HDI PCB in the Era of AI Servers A revolution in information technology is taking place by HDI PCB (High-Densit...