PCB Simulation Case Setup - 

Test Vehicle / DUT: Top Layer Differential Pair

• Note: DUT stands for "Device Under Test." "Test Vehicle" is common for experimental boards.

PCB Parameter Settings:  Target Differential Impedance: 100Ω

• Substrate Material: Panasonic Megtron 6 (M6)
• PCB Surface Finish: Solder Mask Defined 

Modeling Basis: Microsection Analysis and 3D Structural Models

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PCB Protection against Oxidation and Scratches-

It protects the surface copper foil from oxidation and physical damage.

Thus, the influence of PCB green oil thickness on high-speed signals.

There was a case for this :

100Ω differential microstrips on M6 laminate (top layer) with green solder mask:

The PCB cross-sectional analysis provides a comprehensive assessment of the fabrication build-up, 

accounting for trace geometry, dielectric height, copper surface profile, and solder mask deposition.

Check out this animation showing how solder mask thickness—ranging from 0.2 to 1.2 mils—affects high-speed signal integrity on the top layer.

Scaling the  PCB solder mask thickness from 0.2 mil to 1.2 mils results in a differential impedance drop from 104Ω to 98Ω, exceeding a 5Ω total variance.

Another critical parameter affected is insertion loss. 

The PCB test data shows that scaling the solder mask from 0.2 to 1.2 mils leads to a nearly 20% penalty in loss performance, emphasizing why precise mask control is vital for high-speed designs.

Conclusions and Engineering Insights for PCB Solder Mask： 

1. Printed circuit board solder mask thickness is a non-negligible factor.
2. PCB Board manufacturing process details directly impact high-speed signal integrity.
3. PCB design and fabrication must adopt an integrated approach to impedance and loss control.