Automotive Multi Camera System Demands and Challenges in PCB Process

As we hit L3, we’re looking at 8–12 cameras per car. The math is simple: more autonomy, more "eyes."

EVs are averaging 4.5 cameras per vehicle, nearly doubling the 2.8 seen in traditional gas cars.

Euro NCAP and related mandates are making DMS/OMS a standard kit, not just a premium perk. EVs are averaging 4.5 cameras per vehicle, nearly doubling the 2.8 seen in traditional gas cars.

What’s actually changing in Automotive Camera Modules? The industry is moving fast toward 8MP+ for front-view cameras. High-res is no longer optional for long-range sensing. The techcological realization of Seeing in the dark is about night Vision and multispectral fusion now. Toss in HDR and Wide Dynamic Range, and you’ve got sensors that don't blink in tough lighting. In the meantime, the reliability here means true auto-grade toughness—handling everything from -40°C to 105°C with 30g vibration resistance. It’s engineered to endure, not just function. AI ISP and "Sense-Compute" integration are hitting the road. We’re processing a “sense, compute, connect, display” integration system.

Let's get a further discuss about the challenges in PCB process.

• Demand: 8MP+ for front-view cameras and AI ISP

Challenge in PCB design & fabrication : a tight impedance control, material of low loss laminates, optimized Via Stub Tuning for a high-speed signals clean and killing reflections and attenuation.

• Demand: AI ISP chips, an integrated high-density compute nodes.

Challenge in PCB design & fabrication : PCB thermal management is a bottleneck. PCBs now require a large number of  thermal vias, or even advanced Coin-in-PCB and ceramic substrates to prevent "dark current" noise from trashing the sensor output as things heat up.

• Demand: 8–12 cameras per car--an ultra-save space design but doubling functions

Challenge in PCB design & fabrication :  Promote the advanced PCB processing technology of  Any Layer HDI Modified Semi-Additive Process (MSAP) to support the PCB layout design with ultra-fine 30/30μm  lines and spaces.

• Demand: flex and rigid PCB instead of the original solution: learn more about KNOWNPCB Flex and Rigid PCB

Challenge in PCB design & fabrication :  level up manufacturing capability of controlled-depth drilling, flex-to-rigid bonding, pad alignment precision.

Demand: Pass a 30g-vibration, high-cycle endurance test, brutal environments— -40°C to 105°C

Challenge in PCB design & fabrication :  cost of PCB material - High Tg and high Td and low CTE prevent to barrel cracking during thermal cycling.

strong quality of Prepreg (PP) passes Anti-CAF test.

thickness of copper and surface finish: a big shift  from ENIG to ENEPIG to kill "Black Pad" risk and enhance strength for both gold wire bonding and heavy-copper soldering.

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Auto-grade vs. Industrial/ Consumer?

Automotive cameras demand much tougher materials and packaging than industrial or commercial gear, from from raw PCB laminates to packaging—must hit much higher bars.

 They have to stay stable under thermal shocks, intense vibes, and moisture. Achieving a cost-effective, long-life design across PCB fab and assembly requires one thing: perfect coordination across the entire supply chain.

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