Type of gold fingers

Gold Finger Overview

The gold finger possesses excellent electrical conductivity, ensuring efficient signal and current transmission.

Additionally, it offers strong corrosion resistance, effectively withstanding oxidation and corrosion.

Lastly, gold fingers exhibit robust mechanical strength, capable of enduring repeated insertion, removal, and contact pressure.

Type	Description
General Gold Finger	Horizontal or evenly aligned fingers with uniform length and width.
Long-and-Short Gold Finger	Finger pads share the same width but differ in length.
Segmented Gold Finger	Segmented fingers with varying lengths and non-continuous layout.

Category	Description
Characteristics	Gold fingers provide excellent conductivity, corrosion resistance, and mechanical durability, supporting stable signal transmission and repeated mechanical contact.
Function	They serve as reliable electrical contact interfaces between PCBs and connectors or card slots.
Application Fields	Widely used in mobile phones (SIM and battery connectors), computers (memory and expansion card slots), and automotive electronics such as dashboards, infotainment, and navigation systems.

Plated through-holes should be kept away from the gold finger area.
For PCBs that are frequently inserted and removed, hard gold plating is recommended to improve wear resistance.
Gold fingers should be chamfered, typically at 45°, with 20° or 30° also acceptable.
Solder mask dams between gold fingers should be removed to create a single continuous solder mask opening.